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February 2018

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Subject:
Re: IPC-TM-650 section 2.1.1
From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Mon, 19 Feb 2018 19:59:44 +0000
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The above is a micro section specimen prep method, you may be evaluating specimens not subjected to thermal stress at all. The method is not a function of whether samples have been stressed or not, nor which thermal stress method were used if they were.

> On Feb 19, 2018, at 10:59 AM, [log in to unmask] wrote:
> 
> Fellow TechNetters:
> 
>  Why is it that the above stated TM does not make any reference to IPC-TM-650 section 2.6.8 (Thermal Stress, Plated-Through Holes) or 2.6.27 (Thermal Stress, Convection Reflow Assembly)?
> 
> Victor,

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