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Subject:
IPC-TM-650 section 2.1.1
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 19 Feb 2018 15:59:56 +0000
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Fellow TechNetters:

  Why is it that the above stated TM does not make any reference to IPC-TM-650 section 2.6.8 (Thermal Stress, Plated-Through Holes) or 2.6.27 (Thermal Stress, Convection Reflow Assembly)?

Victor,

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