There is a clause in the IPC1601 that doesn't seem right to me. It says:
The material (PCB) should be cooled as rapidly as rapidly as possible in a
dry environment. Hot material in a humid environment will rapidly reabsorb
moisture. For best results, cool in the oven if possible . . .

Usually, my intuitions align with science. But, it seems counter intuitive
to me that a hot absorbent material would absorb moisture form a cool humid
environment faster than an absorbent material at the same temperature as
the humid environment.

Wouldn't it make more sense to take the boards from the oven to a cool dry
environment?