Hi All, 

 

I am wondering about thermal stress testing per IPC-TM-650 2.6.27 (260°
reflow profile 6x) as one of the requirements in IPC-6012

 

For Assemblers:

Do you require this of all fab houses you buy from?

Do you request your customer add it to the FAB drawing?

 

For Fab Houses:

Do you automatically do this as part of your QC plan ?

How often? Per lot? Per Date Code? Etc.

Do you only do it when requested?

Do you require it to be on the fab drawing or could a CM flow it down
through the PO even though the fab drawing is from the end customer?

Material depending, would you run 260° even if it was not a lead-free PCB?

 

Any other comments welcomed.

 

Craig Sullivan

Manufacturing Engineer

IT Administrator

Phone:  (607) 266-0480 x115

Fax:  (607) 266-0482

Email:  <mailto:[log in to unmask]> [log in to unmask]

Web:   <http://www.mplinc.com/> www.mplinc.com

 

MPL, Inc. 

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An ISO 9001:2008 Certified and ITAR Registered Company

IPC member since 2004 

 

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