The above is a micro section specimen prep method, you may be evaluating specimens not subjected to thermal stress at all. The method is not a function of whether samples have been stressed or not, nor which thermal stress method were used if they were.
> On Feb 19, 2018, at 10:59 AM, [log in to unmask] wrote:
>
> Fellow TechNetters:
>
> Why is it that the above stated TM does not make any reference to IPC-TM-650 section 2.6.8 (Thermal Stress, Plated-Through Holes) or 2.6.27 (Thermal Stress, Convection Reflow Assembly)?
>
> Victor,