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February 2018

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TechNet <[log in to unmask]>
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Wed, 7 Feb 2018 15:56:25 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Subject:
Re: via design for power stitching with heavy copper
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Doug Brooks published the results of a study on the subject at: http://ultracad.com/articles/via.pdf


On Fri, 19 Jan 2018 19:00:08 +0000, Nutting, Phil <[log in to unmask]> wrote:

>Many of our designs use 1, 2 or 4 ounce copper for our heavy current applications.  Vias and plated holes might have � or 1 ounce of copper plated in.  So, is there a design guide for the number and size of holes to effectively transfer the current from one side of the board to the other side of the board?
>
>Phil Nutting  |  HVP Senior Development Engineer   |  Excelitas Technologies Corp

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