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January 2018

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Mon, 29 Jan 2018 12:51:58 -0500
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text/plain (69 lines)
8% rings a  bell... too low you got problem with magnetic properties  
issues, too high you got stress issues or mechanical properties  
issues... it just starting point... many other effect also play a  
role on the concentration... (morphology, surface oxidation,  
etc.etc.).  IMHO.
jk
On Jan 29, 2018, at 11:20 AM, Stadem, Richard D wrote:

> Per IPC-4552 which defines ENIG plating which is what I assume you  
> are talking about, and not ENEPIG, the phosphorus and boron content  
> is mentioned in section 1.2.1 and within Table 3-1 it references  
> ASTM-B-733-97 and ASTM B607-91. It depends on the plating company  
> and the specific ENIG plating product; no specific value is given  
> other than it should be controlled within the specific process  
> limit, which is (usually) a function of the plating product  
> (Technical Data Sheet) used. No testing is required. The desired  
> range from the many papers I have read always point to an "ideal  
> range" of 7 to 10% P, but that may have changed in the past two or  
> three years.
> Many factors other than the P-level are just as or more important,  
> however. For example, if the gold thickness is too high it can also  
> result in an attack on the nickel which results in a change in the  
> P-level. If the nickel bath is less than 4% P, the general  
> consensus is for sure it is much too acidic and will result in  
> problems. But it all depends.....Kachink.
> But whatever it is for the specific product and process used, all  
> of the standards, documents, and papers written on the subject say  
> the same thing; the ideal process parameters are required to be  
> precisely identified, documented, and carefully controlled and  
> monitored. If the plating company does not have real-time  
> monitoring and datalogging equipment in place and being used, don't  
> use that vendor.
> dean
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Frank Kimmey
> Sent: Monday, January 29, 2018 9:45 AM
> To: [log in to unmask]
> Subject: [TN] Phosphorus content in Electroless Nickel
>
> Hey FAB Guys (or Chemical types or anyone else who might help),  
> What should the P content in the Electroless Nickel bath be?
> I am concerned some of our suppliers are running to high.
> This could be the cause of some Brittle Fracture failures I have  
> been seeing.
> What would you consider a good range for Phosphorus percentage in  
> the Electroless Nickel bath?
> Thanks,
> FNK
>
> Frank N Kimmey CID+
> Electrical Engineer / PCB Design
> VeriFone Inc
> 1400 W Stanford Ranch Road, Suite 200
> Rocklin, CA 95765 USA
> W: 1-916-625-1818
> M: 1-916-833-9877
> [log in to unmask]
>
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