Other TechNetters have provided some good information on the various standards involved. For whatever good it does, I'll mention that I think it took the copper foil committee 10 years to agree on a method for measuring surface roughness. When I was responsible for peel strength testing of MIL-PRF-31032 boards and had to be concerned if a foil was 'low profile', I could not find a definition of that terminology. Colleagues and I agreed among ourselves what we thought it meant and thus when we would need to meet the low profile peel strength requirement. Louis Hart 

----- Original Message -----

From: "Victor G Hernandez" <[log in to unmask]> 
To: [log in to unmask] 
Sent: Monday, January 22, 2018 8:09:37 AM 
Subject: [TN] FW: copper foil tooth size selection 

Dell - Internal Use - Confidential 

Fellow TechNetters: 

I did not receive any responses to my initial inquiry. Therefore, the second time is a charm. 

Victor, 

-----Original Message----- 
From: Hernandez, Victor G 
Sent: Friday, January 19, 2018 1:43 PM 
To: TechNet E-Mail Forum <[log in to unmask]> 
Cc: Hernandez, Victor G <[log in to unmask]> 
Subject: copper foil tooth size selection 


Fellow TechNetters: 

Is there an IPC STD that makes reference to copper foil tooth size with respect to High Speed Frequency Switching? The smaller the tooth size the lower the copper foil peel strength..... 

Victor,