IPC 4562A describes copper foils but not their end-use/applications (like when, or when not to, use low profile foils).
IPC 2252 (and 2251) may provide guidance on that. Those are the current RF design specs, and are called out as reference in 6018C (which is the ‘6012’ equivalent to RF/Microwave boards).
There’s an effort now to update RF design specs, into a new document, IPC 2228. Thats still a while from release.

A lower dendritic profile foil would have a lower peel strength requirement per 4101 than its conventional dendritic foil. So dont let lower peel strength discourage you from using it if the application requires it for performance.


José (Joey) Ríos, Sr QA Engineer
Mission Assurance Manager
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
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(617)324-6272




> On Jan 19, 2018, at 2:42 PM, [log in to unmask] wrote:
> 
> Dell - Internal Use - Confidential  
> 
> Fellow TechNetters:
> 
>   Is there an IPC STD that makes reference to copper foil tooth size with respect to High Speed Frequency Switching?   The smaller the tooth size the lower the copper foil peel strength.....
> 
> Victor,