Hi Guy,

I have your pictures published, here are the links:

http://stevezeva.homestead.com/ddr3-board.jpg
http://stevezeva.homestead.com/ddr3-device2.jpg

Steve

On Mon, Jan 22, 2018 at 8:02 AM, Guy Ramsey <[log in to unmask]> wrote:

> So, is poor solderability like the flu . . .
> We are having a rash of it.
> We identified the EPENIG solder problem as a surface contaminate,
> originating at the board house in the final rinse water.
> We did not get to the bottom of the ENIG problem which I am thinking we
> own.
> Here is why.
> The "black pads" may be found on either the board or the device. I have
> attached a photo of each, one on the board and one on the device package.
>
> These are soldered with a WS Pb-free flux. We have carefully developed the
> profile with  a long soak, to minimize the void problems on LGA. Ramp,
> soak, and reflow are all within recommendations of the solder paste
> manufacturer.
>
> Steve can you put these up for me. The problem does seem to be more common
> on the DDR3 memory devices than any of the other BGA types.
>



-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

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