Dear Technetters:

Since it is winter in Chicago and much of the northern realms, the RH
values are getting under 20% when the heat is on.

Outside of ESD issues, board assemblers have the issues of solder paste
drying out and not having enough active flux during the reflow cycle. This
can even happen with WS fluxes that are very active.

There are a handful of CMs in the great northern realms of MI, NY, MN and
WI that are using misting systems (that come with their own set of
problems) to keep the RH values higher in the winter months.

What are others doing (outside of monitoring) to deal with this issue and
solder paste printing?

The opposite can be true on those very humid summer days when the past
slumps easily.

Thanks!
-- 
Bob Wettermann
BEST Inc