Another thought that may allow for recovery of the assembly/assemblies and goes hand in hand with what has already been posited is to procure a 2 - 2.5 mil stencil.  1st pass with an ORH0/ORH1 or similarly aggressive paste (Alpha WS698CPS is SAC305), Indium has Indium3.2/Indium3.2HF in SAC and Indium6.3 is Tin/Lead.  Pass the PCB only through reflow with a long & low preheat and then spike to burn off the flux.  *You must wash the PCB then.  Using the same stencil, a second pass with your preferred paste would be in order.  Based off of our blind side-by-side, re-run with an Indium paste.  Since you will be building up solder layer with the first pass, the stencil needs to be thinner on the second pass or you will have extensive solder balling.