Hi Dave,

No I don't. The post was from a friend and that's all I have...

Steve

On Thu, Dec 21, 2017 at 12:56 PM, David Hillman <
[log in to unmask]> wrote:

> Hi Steve - do you know what original board finish was used? ENIG? ImAg?
> ImSn?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
> On Thu, Dec 21, 2017 at 1:39 PM, Steve Gregory <[log in to unmask]> wrote:
>
>> Hi all,
>>
>> I've been asked to post this to the Technet by a dear friend:
>>
>> *We installed this little processor. At test we identified opens on the
>> device. When we removed it we saw a number of pads that were matte gray
>> with no evidence of solder adhered to the pad. *
>> *We attempted to bump the pads with solder, they did not wet easily. In
>> some cases we had to scrape through the matte finish to a shiny metal.
>> But, we did get all the pads to appear wetted.*
>>
>> *We cleaned the site well and then fluxed the bumps with a tacky flux ROLO
>> designed for POP, placed the BGA and reflowed it on a rework station.*
>>
>> *The assembly failed test with similar result, opens under the processor.*
>>
>> *The attached photo shows that the bump process only appeared to wet the
>> pads. The condition returned when we removed the BGA  second time.*
>>
>> * http://stevezeva.homestead.com/2017-12-21_11.21.17.jpg
>> <http://stevezeva.homestead.com/2017-12-21_11.21.17.jpg>*
>>
>> *Have you seen this before? Is there any recovery? This assembly is worth
>> about $45K. *
>>
>> Thanks,
>>
>> Steve
>>
>> --
>> Steve Gregory
>> Kimco Design and Manufacturing
>> Process Engineer
>> (208) 322-0500 Ext. -3133
>>
>> --
>>
>>
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>
>


-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

-- 


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