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Subject:	Re: -\|EXT\|- [DC] MELF Land Patterns
From:	HEAD James <[log in to unmask]>
Reply To:	TechNet E-Mail Forum <[log in to unmask]>, HEAD James <[log in to unmask]>
Date:	Tue, 5 Dec 2017 07:25:31 +0000
Content-Type:	text/plain
Parts/Attachments:	text/plain (1 lines)

I have still used MELF components but only diodes where no suitable alternative was available for protection circuitry in ATEX/IECEx designs.

If the manufacturer has a recommended footprint then I've used that: a couple of these did have U shaped cut-outs. Otherwise I've used rounded-rectangular pads as calculated by PCB Libraries for nominal density. I have never had any feedback from the assembler about any issues and never seen any issues with skewed components.

Regards,

James



James Head

Oxford Instruments

Magnetic Resonance

www.oxford-instruments.com

www.twitter.com/oxinst : @oxinst

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Tubney Woods, Abingdon, Oxon OX13 5QX, UK 

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-----Original Message-----

From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Jack Olson

Sent: 04 December 2017 16:57

To: [log in to unmask]

Subject: -|EXT|- [DC] MELF Land Patterns



I am using MELF components on my current design, which I haven't seen much this century.

But I remember way back when we used "U-shaped" land shapes.



I notice the current Land Pattern standard (IPC-7351) recommends rectangular, but at least one person has wondered if we should use U-shaped "just in case".

I generally resist that kind of philosophy unless there is science behind it.

Is anyone using U-shaped pads anymore?

(Is anyone using MELFs anymore? (smile))



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