Subject: | |
From: | |
Reply To: | |
Date: | Wed, 6 Dec 2017 15:29:50 +0000 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Jack,
Do you document that the paste layer is the Assembler responsibility?
I use a note: "SOLDER PASTE FILES MAY BE MODIFIED TO BEST FIT REQUIRED PRACTICES"
Then my Library has all paste layers at 1:1
That puts the stencil completely on the Assembler and let's them do what is best for them to give you what you want.
Hope it helps,
FNK
Frank N Kimmey CID+
Electrical Engineer / PCB Design
VeriFone Inc
1400 W Stanford Ranch Road, Suite 200
Rocklin, CA 95765 USA
W: 1-916-625-1818
M: 1-916-833-9877
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jack Olson
Sent: Wednesday, December 06, 2017 7:23 AM
To: [log in to unmask]
Subject: [EXT] Re: [TN] MELF land shapes
Thank you all for the responses.
My only other question is related to something I heard from the Designer Council, that some people are using rectangular pads with u-shaped paste apertures.
That's preferable to me because I don't design paste screens, but not sure how common that is...
*********************************************************
This electronic message and any attachments are intended only for the use of the addressee. The information in this electronic message is confidential and proprietary, and may include privileged information. If you are not the intended recipient, please delete this electronic message and any attachments and notify the sender of the error. Please be aware that any unauthorized use, dissemination, distribution or copying of this message or any attachments is strictly prohibited.
|
|
|