TECHNET Archives

November 2017

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ron Feyereisen <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ron Feyereisen <[log in to unmask]>
Date:
Wed, 8 Nov 2017 15:05:50 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (13 lines)
Hi Technetters,

Just wondering if anyone has come across this issue-

We're being asked to Wave process assemblies that use small 3mm through-hole LEDs. We started to see a high failure rate during product testing of these LEDs and the root cause investigation found that, after verifying that the profile was per recommended, the LEDs are stated on the datasheet as being moisture-sensitive and require baking after 72 hrs being out of the original bulk poly bag packaging. (not a moisture barrier bag)

The manufacturer's original packaging is insufficient to protect against moisture absorption since it's not a MBB, does not state the LEDs are moisture-sensitive and do not contain desiccant nor a humidity indicator card. Since J-STD-033 only refers to surface mount devices, what other industry controls are in place to identify moisture-sensitive through-hole devices such as these? The 72 hour requirement should be handled as MSL 4 but the manufacturer is saying that it only applies to SMDs for the marking and packaging. We do not want to have to bake these LEDs each time we run the assy, as well as mitigating defects.

Any suggestions for recourse on this issue? It'll be much appreciated!

Thanks,
Ron

ATOM RSS1 RSS2