Richard,
If you intend to do power on testing of populated boards you must consider the type of coating (primarily the glass transition temperature) and coating coverage of leads with 90 degree edges plus under components, and pointed ends.

If your product is going to be used in a condensation type environment I strongly recommend you hermetically seal it. Remember water molecules are one of the smallest! What could occur is dendritic growth and intermittent shorts (worst case)!

David A. Douthit

Sent from my iPad
"
> On Nov 22, 2017, at 2:46 PM, Richard Kraszewski <[log in to unmask]> wrote:
> 
> Other than what is written in IPC CC830 for thermal shock  and MIR testing , is anyone away of  any  industry standard that addresses the functionality of coating  or devices  when exposed to condensation?
> 
> I have looked  at the IP Code for water ingress but all of that water testing  seems too invasive & harsh for what I am looking for. 
> 
> https://en.wikipedia.org/wiki/IP_Code
> 
> Something in IEC perhaps. 
> 
> Rich  Kraszewski 
> Senior Staff Process Engineer
> Plexus Engineering Solutions 
> 
> 
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