You’ve cited the applicable acceptance criteria, what you describe is not a reason for rejection unless these are wirebond pads, or if there is missing Au visible at 3 diopters.



Sent from my iPhone



On Nov 1, 2017, at 11:39 AM, Gricel Guerrero-Gomez <[log in to unmask]<mailto:[log in to unmask]>> wrote:



Hello,



I received a batch of boards that show  what I would described as multiple nodules or "rough" surface all over the ENIG plated pads and mount holes. I have other batches where the surface looks smooth an even (no nodules). I would share a picture but I could not get to www.ipc.org/technet-photos<http://www.ipc.org/technet-photos>.



I was trying to find anything related to these on IPC-6012 or IPC-4552 standards to see if this is acceptable.



What I found on the versions I have, is  that IPC-6012 only mentions for rectangular and round surface lands that any defect shall be maintained outside the pristine area, on the other hand a Wire Bond pad does mention a roughness requirement of 0.8*m RMS. All I found on IPC-4552 is that the surface shall be uniform.



Is there any requirement of roughness for the rectangular and round surface lands? Or, any specification on how big the nodules have to be to be considered a defect?



Thank you



Gricel Guerrero

Manufacturing Engineer

AJA Video Systems

(530) 271-3324