Thank you for the input, the Fab house is taking these back.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce Koo
Sent: Wednesday, November 01, 2017 12:17 PM
To: [log in to unmask]
Subject: Re: [TN] ENIG Nodules

what you use the pad for?  do a tape test, if it is fall off, reject (most likely, organic additive or contamination or bath degraded or pH issues... or gold depleted)... good luck.  anyhow, deviated from your qual sample is not acceptable (it is like you buy stuff based on demo and get cheated by crappy stuff shipped to you... )... IMHO.
On Nov 1, 2017, at 11:38 AM, Gricel Guerrero-Gomez wrote:

> Hello,
>
> I received a batch of boards that show  what I would described as 
> multiple nodules or "rough" surface all over the ENIG plated pads and 
> mount holes. I have other batches where the surface looks smooth an 
> even (no nodules). I would share a picture but I could not get to 
> www.ipc.org/technet-photos.
>
> I was trying to find anything related to these on IPC-6012 or
> IPC-4552 standards to see if this is acceptable.
>
> What I found on the versions I have, is  that IPC-6012 only mentions 
> for rectangular and round surface lands that any defect shall be 
> maintained outside the pristine area, on the other hand a Wire Bond 
> pad does mention a roughness requirement of 0.8*m RMS.
> All I found on IPC-4552 is that the surface shall be uniform.
>
> Is there any requirement of roughness for the rectangular and round 
> surface lands? Or, any specification on how big the nodules have to be 
> to be considered a defect?
>
> Thank you
>
> Gricel Guerrero
> Manufacturing Engineer
> AJA Video Systems
> (530) 271-3324