Hmmmmm not sure what the thermal shock would do to the assembly.
John Burke
		

		Sent from my iPad Pro
	





On Wed, Nov 1, 2017 at 4:14 PM +0000, "Wayne Thayer" <[log in to unmask]> wrote:










Hi-

I've been off line for the past 6 months, so hello again. It was our durned
corporate email server, so I just switched to a personal account.

Anyway, I recall seeing a discussion a few years ago where the subject was
dye & pry, and someone mentioned using cryogenics (LN2) to make sure of
getting brittle fracture in the joints which could conceivably save the PCB
rather than using the technique detailed in IPC-TM-650 #2.4.53

Has anyone presently listening tried this?

Thanks,

Wayne