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November 2017

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Subject:
From:
Wayne Thayer <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Wayne Thayer <[log in to unmask]>
Date:
Wed, 1 Nov 2017 09:04:38 -0700
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Hi-

I've been off line for the past 6 months, so hello again. It was our durned
corporate email server, so I just switched to a personal account.

Anyway, I recall seeing a discussion a few years ago where the subject was
dye & pry, and someone mentioned using cryogenics (LN2) to make sure of
getting brittle fracture in the joints which could conceivably save the PCB
rather than using the technique detailed in IPC-TM-650 #2.4.53

Has anyone presently listening tried this?

Thanks,

Wayne

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