This has always been a very confusing topic, Dave. Thanks.
But I still don't see why they cannot be combined into a single document.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Monday, October 30, 2017 3:22 PM
To: [log in to unmask]
Subject: Re: [TN] Plated Through Hole, PTH, annular ring solder wetting with component lead
Hi team - Just a point of clarification as I see this point pop up with some frequency. The requirements for a printed circuit assembly are in the
IPC-JSTD-001 specification and the Workmanship Criteria reflecting those requirement as in the IPC-A-610. I know if sounds mundane and lots of folks typically cite the 610 specification as the "requirements" since that is what the operators/auditors have in their hands but using specific document clarity is important in our industry. We have tons of requirements and criteria so citing 001/610 correctly and as a set can be super beneficial for everyone. Sorry for the soapbox, just trying to be positive and proactive.
Dave Hillman
Rockwell Collins
On Mon, Oct 30, 2017 at 3:00 PM, Stadem, Richard D <[log in to unmask]
> wrote:
> You nailed it Jerry! Thanks from all of us.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler
> Sent: Monday, October 30, 2017 2:41 PM
> To: [log in to unmask]
> Subject: Re: [TN] Plated Through Hole, PTH, annular ring solder
> wetting with component lead
>
> Victor,
>
> See IPC-A-610F.
> Section 7.3.5 Supported Holes - Solder This addresses all of the
> requirements including "Source Side" and "Destination Side" land area
> coverage.
>
> Jerry
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Monday, October 30, 2017 3:34 PM
> To: [log in to unmask]
> Subject: [TN] Plated Through Hole, PTH, annular ring solder wetting
> with component lead
>
> Fellow TechNetters:
>
> Where within the all IPC and other industry Standards can I locate
> information on PTH annular ring solder wetting on side 1, component
> side, and side 2 solder side. Does PTH annular ring solder wetting
> REQUIRED in TODAY"S fast pace assemblies.
>
> Victor,.
>
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