And FWIW my previous citation of J-STD-003 relates to bare board acceptance testing, and not finished assemblies.
Sent from my iPhone
On Oct 30, 2017, at 4:25 PM, Ken Barton <[log in to unmask]<mailto:[log in to unmask]>> wrote:
This is why I read every TechNet post, ALWAYS something to learn.
Ken Barton CID
Technical Designer,
Avionics HW
Blue Origin, LLC
21218 76th Avenue S.
Kent, WA 98032 (253) 437-5625 x625
[log in to unmask]<mailto:[log in to unmask]>
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David Hillman
Sent: Monday, October 30, 2017 1:22 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [EXTERNAL] Re: [TN] Plated Through Hole, PTH, annular ring solder wetting with component lead
Hi team - Just a point of clarification as I see this point pop up with some frequency. The requirements for a printed circuit assembly are in the
IPC-JSTD-001 specification and the Workmanship Criteria reflecting those requirement as in the IPC-A-610. I know if sounds mundane and lots of folks typically cite the 610 specification as the "requirements" since that is what the operators/auditors have in their hands but using specific document clarity is important in our industry. We have tons of requirements and criteria so citing 001/610 correctly and as a set can be super beneficial for everyone. Sorry for the soapbox, just trying to be positive and proactive.
Dave Hillman
Rockwell Collins
On Mon, Oct 30, 2017 at 3:00 PM, Stadem, Richard D <[log in to unmask]<mailto:[log in to unmask]>
wrote:
You nailed it Jerry! Thanks from all of us.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler
Sent: Monday, October 30, 2017 2:41 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: Re: [TN] Plated Through Hole, PTH, annular ring solder
wetting with component lead
Victor,
See IPC-A-610F.
Section 7.3.5 Supported Holes - Solder This addresses all of the
requirements including "Source Side" and "Destination Side" land area
coverage.
Jerry
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]<mailto:[log in to unmask]>
Sent: Monday, October 30, 2017 3:34 PM
To: [log in to unmask]<mailto:[log in to unmask]>
Subject: [TN] Plated Through Hole, PTH, annular ring solder wetting
with component lead
Fellow TechNetters:
Where within the all IPC and other industry Standards can I locate
information on PTH annular ring solder wetting on side 1, component
side, and side 2 solder side. Does PTH annular ring solder wetting
REQUIRED in TODAY"S fast pace assemblies.
Victor,.
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