Hi team - Just a point of clarification as I see this point pop up with
some frequency. The requirements for a printed circuit assembly are in the
IPC-JSTD-001 specification and the Workmanship Criteria reflecting those
requirement as in the IPC-A-610.  I know if sounds mundane and lots of
folks typically cite the 610 specification as the "requirements"  since
that is what the operators/auditors have in their hands but using specific
document clarity is important in our industry. We have tons of requirements
and criteria so citing 001/610 correctly and as a set can be super
beneficial for everyone. Sorry for the soapbox, just trying to be positive
and proactive.

Dave Hillman
Rockwell Collins


On Mon, Oct 30, 2017 at 3:00 PM, Stadem, Richard D <[log in to unmask]
> wrote:

> You nailed it Jerry! Thanks from all of us.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler
> Sent: Monday, October 30, 2017 2:41 PM
> To: [log in to unmask]
> Subject: Re: [TN] Plated Through Hole, PTH, annular ring solder wetting
> with component lead
>
> Victor,
>
> See IPC-A-610F.
> Section 7.3.5 Supported Holes - Solder
> This addresses all of the requirements including "Source Side" and
> "Destination Side" land area coverage.
>
> Jerry
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Monday, October 30, 2017 3:34 PM
> To: [log in to unmask]
> Subject: [TN] Plated Through Hole, PTH, annular ring solder wetting with
> component lead
>
> Fellow TechNetters:
>
>    Where within the all IPC and other industry Standards can I locate
> information on PTH annular ring solder wetting on side 1, component
> side, and side 2 solder side.   Does PTH annular ring solder wetting
> REQUIRED in TODAY"S fast pace assemblies.
>
> Victor,.
>