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October 2017

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Subject:
Re: Plated Through Hole, PTH, annular ring solder wetting with component lead
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Mon, 30 Oct 2017 20:00:23 +0000
Content-Type:
text/plain
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text/plain (31 lines) 
You nailed it Jerry! Thanks from all of us.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jerry Dengler
Sent: Monday, October 30, 2017 2:41 PM
To: [log in to unmask]
Subject: Re: [TN] Plated Through Hole, PTH, annular ring solder wetting with component lead

Victor,

See IPC-A-610F.
Section 7.3.5 Supported Holes - Solder
This addresses all of the requirements including "Source Side" and "Destination Side" land area coverage.

Jerry


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Monday, October 30, 2017 3:34 PM
To: [log in to unmask]
Subject: [TN] Plated Through Hole, PTH, annular ring solder wetting with component lead

Fellow TechNetters:

   Where within the all IPC and other industry Standards can I locate information on PTH annular ring solder wetting on side 1, component
side, and side 2 solder side.   Does PTH annular ring solder wetting
REQUIRED in TODAY"S fast pace assemblies.

Victor,.

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