TECHNET Archives

October 2017

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Plated Through Hole, PTH, annular ring solder wetting with component lead
From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Mon, 30 Oct 2017 19:38:22 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines) 
J-STD-003 for acceptance testing and IPC-610 (or J-STD-001) for workmanship inspection.



Sent from my iPhone



On Oct 30, 2017, at 3:34 PM, "[log in to unmask]<mailto:[log in to unmask]>" <[log in to unmask]<mailto:[log in to unmask]>> wrote:



Fellow TechNetters:



  Where within the all IPC and other industry Standards can I locate information on PTH annular ring solder wetting on side 1, component side, and side 2 solder side.   Does PTH annular ring solder wetting REQUIRED in TODAY"S fast pace assemblies.



Victor,.

ATOM RSS1 RSS2