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October 2017

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Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Tue, 17 Oct 2017 12:35:00 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (95 lines)
are those wire bond fingers or zif?  if it is wire bond fingers, you  
better use ribbon bond and pull it up and see if it sticks...(3x-5x  
stronger than what ever your wire is...).  none  std, but works  
well.  (your vendor may not like it... if you have enough order, they  
will go along..or go find another vendor).
On Oct 17, 2017, at 11:44 AM, <[log in to unmask]>  
<[log in to unmask]> wrote:

> Dell - Internal Use - Confidential
>
> John,
>
> I was attempting to conduct a Copper Peel Test on lifting gold  
> fingers and NOT the Au plating process.
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
> Sent: Tuesday, October 17, 2017 9:24 AM
> To: [log in to unmask]
> Subject: Re: [TN] Copper Peel Test
>
> 	
> 		
> 		
> 	
> 		
> 		I thought he was peeling the copper to check for adhesion to the  
> laminate?
> 		
>
> 		Sent from my iPad Pro
> 	
>
>
>
>
>
> On Tue, Oct 17, 2017 at 9:23 PM +0700, "Ed Popielarski"  
> <[log in to unmask]> wrote:
>
>
>
>
>
>
>
>
>
>
> Hi Victor,
>
> Use this method: http://www.ipc.org/4.0_Knowledge/4.1_Standards/ 
> test/2.4.1E.pdf and examine the tape under a 30X microscope. Poor  
> plating issues typically are discovered by observing small pieces  
> of the gold plating (or worse) on the tape.
>
> Regards,
>
> Ed Popielarski
> Engineering Manager
>
>
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0695
>                               Cl: 360-544-2289
>
>
>
>        "It's one kind of victory to slay a beast, move a mountain,  
> and cross a chasm, but it's another kind altogether to realize that  
> the beast, the mountain, and the chasm were of your own design."
> https://goo.gl/maps/mMjg43rXeFB2
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of  
> [log in to unmask]
> Sent: Tuesday, October 17, 2017 6:53 AM
> To: [log in to unmask]
> Subject: [TN] Copper Peel Test
>
> Fellow TechNetters:
>
>     I have been presented with an opportunity to excel.   Has  
> anyone out there conducted a Copper Peel Test om gold fingers on  
> PWB/DIMM/Options cards.   The Cu peel test that I am accustom to is  
> on laminate cores.   Is this a viable test on very small real  
> estate/surface area.
>
> Victor,

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