From your original question, I take it you want to test adhesion of a small conductor feature to underlying laminate. If the ‘gold fingers’ have been gold plated already, the peel test contained in the IPC test methods (2.4.8C), and the pass/fail criteria, are based on copper clad laminate using a coupon like the N coupon, ahead of final finish. My only caution is that if you deviate from 2.4.8C (in either test specimen and/or final finish vs no finish), and use the pass/fail criteria outlined in this method, you may be misled with the results and reject good product unnecessarily.

Method 2.4.1 tests plating layer adhesion, of either final finish to underlying copper, or plated copper to underlying copper foil.

I dont know of an IPC test method that describes what you’re trying to do. 


José (Joey) Ríos, Sr QA Engineer
Mission Assurance Manager
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
[log in to unmask] <mailto:[log in to unmask]>
(617)324-6272



> On Oct 17, 2017, at 8:44 AM, [log in to unmask] wrote:
> 
> Dell - Internal Use - Confidential  
> 
> John,
> 
> I was attempting to conduct a Copper Peel Test on lifting gold fingers and NOT the Au plating process.
> 
> Victor,
> 
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
> Sent: Tuesday, October 17, 2017 9:24 AM
> To: [log in to unmask]
> Subject: Re: [TN] Copper Peel Test
> 
> 	
> 		
> 		
> 	
> 		
> 		I thought he was peeling the copper to check for adhesion to the laminate?
> 		
> 
> 		Sent from my iPad Pro
> 	
> 
> 
> 
> 
> 
> On Tue, Oct 17, 2017 at 9:23 PM +0700, "Ed Popielarski" <[log in to unmask]> wrote:
> 
> 
> 
> 
> 
> 
> 
> 
> 
> 
> Hi Victor,
> 
> Use this method: http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf and examine the tape under a 30X microscope. Poor plating issues typically are discovered by observing small pieces of the gold plating (or worse) on the tape. 
> 
> Regards,
> 
> Ed Popielarski
> Engineering Manager
> 
> 
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> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
> Sent: Tuesday, October 17, 2017 6:53 AM
> To: [log in to unmask]
> Subject: [TN] Copper Peel Test
> 
> Fellow TechNetters:
> 
>    I have been presented with an opportunity to excel.   Has anyone out there conducted a Copper Peel Test om gold fingers on PWB/DIMM/Options cards.   The Cu peel test that I am accustom to is on laminate cores.   Is this a viable test on very small real estate/surface area.
> 
> Victor,