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October 2017

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Subject:
From:
Bob Wettermann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Bob Wettermann <[log in to unmask]>
Date:
Tue, 17 Oct 2017 09:33:23 -0500
Content-Type:
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Victor:

What are the gold finger geometries?

Bob

On Tue, Oct 17, 2017 at 9:22 AM, Ed Popielarski <[log in to unmask]>
wrote:

> Hi Victor,
>
> Use this method: http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/
> 2.4.1E.pdf and examine the tape under a 30X microscope. Poor plating
> issues typically are discovered by observing small pieces of the gold
> plating (or worse) on the tape.
>
> Regards,
>
> Ed Popielarski
> Engineering Manager
>
>
>                                970 NE 21st Ct.
>                               Oak Harbor, Wa. 98277
>
>                               Ph: 360-675-1322
>                               Fx: 206-624-0695
>                               Cl: 360-544-2289
>
>
>
>        "It's one kind of victory to slay a beast, move a mountain, and
> cross a chasm, but it's another kind altogether to realize that the beast,
> the mountain, and the chasm were of your own design."
> https://goo.gl/maps/mMjg43rXeFB2
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> [log in to unmask]
> Sent: Tuesday, October 17, 2017 6:53 AM
> To: [log in to unmask]
> Subject: [TN] Copper Peel Test
>
> Fellow TechNetters:
>
>     I have been presented with an opportunity to excel.   Has anyone out
> there conducted a Copper Peel Test om gold fingers on PWB/DIMM/Options
> cards.   The Cu peel test that I am accustom to is on laminate cores.   Is
> this a viable test on very small real estate/surface area.
>
> Victor,
>



-- 
Bob Wettermann
BEST Inc
[log in to unmask]
Cell: 847-767-5745

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