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From:
Ed Popielarski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ed Popielarski <[log in to unmask]>
Date:
Tue, 17 Oct 2017 14:22:59 +0000
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Hi Victor,

Use this method: http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf and examine the tape under a 30X microscope. Poor plating issues typically are discovered by observing small pieces of the gold plating (or worse) on the tape. 

Regards,

Ed Popielarski
Engineering Manager


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, October 17, 2017 6:53 AM
To: [log in to unmask]
Subject: [TN] Copper Peel Test

Fellow TechNetters:

    I have been presented with an opportunity to excel.   Has anyone out there conducted a Copper Peel Test om gold fingers on PWB/DIMM/Options cards.   The Cu peel test that I am accustom to is on laminate cores.   Is this a viable test on very small real estate/surface area.

Victor,

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