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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Tue, 17 Oct 2017 15:44:21 +0000
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Dell - Internal Use - Confidential  

John,

I was attempting to conduct a Copper Peel Test on lifting gold fingers and NOT the Au plating process.

Victor,

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Tuesday, October 17, 2017 9:24 AM
To: [log in to unmask]
Subject: Re: [TN] Copper Peel Test

	
		
		
	
		
		I thought he was peeling the copper to check for adhesion to the laminate?
		

		Sent from my iPad Pro
	





On Tue, Oct 17, 2017 at 9:23 PM +0700, "Ed Popielarski" <[log in to unmask]> wrote:










Hi Victor,

Use this method: http://www.ipc.org/4.0_Knowledge/4.1_Standards/test/2.4.1E.pdf and examine the tape under a 30X microscope. Poor plating issues typically are discovered by observing small pieces of the gold plating (or worse) on the tape. 

Regards,

Ed Popielarski
Engineering Manager


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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Tuesday, October 17, 2017 6:53 AM
To: [log in to unmask]
Subject: [TN] Copper Peel Test

Fellow TechNetters:

    I have been presented with an opportunity to excel.   Has anyone out there conducted a Copper Peel Test om gold fingers on PWB/DIMM/Options cards.   The Cu peel test that I am accustom to is on laminate cores.   Is this a viable test on very small real estate/surface area.

Victor,

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