Femto second laser would be the best... check for bio-medical device  
maker... they use fancy substrates cutter... (nano second laser  
works, but side wall a bit rough - if you don't care about edge  
plating, it would be no issue.  imho. for thin substrate like you  
posted, diamond machine cutter might be good.  Did you talk to the  
substrate maker?  (if you want to cut funny shape, laser would be the  
best bet).
On Sep 25, 2017, at 4:04 AM, John Burke wrote:

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> 		
> 		Agreed I would think laser since you can dice silicon with  
> it ...not too sure what wavelength you would need for that though
> 		
>
> 		Sent from my iPad Pro
> 	
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>
> On Mon, Sep 25, 2017 at 3:58 PM +0800, "Peter Barton"  
> <[log in to unmask]> wrote:
>
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> Laser?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of TechNet  
> automatic digest system
> Sent: 23 September 2017 06:00
> To: [log in to unmask]
> Subject: TechNet Digest - 18 Sep 2017 to 22 Sep 2017 (#2017-153)
>
> There is 1 message totaling 42 lines in this issue.
>
> Topics of the day:
>
>   1. Thin alumina substrate cutter
>
> ----------------------------------------------------------------------
>
> Date:    Fri, 22 Sep 2017 18:09:21 +0000
> From:    Ioan Tempea
> Subject: Thin alumina substrate cutter
>
> Dear Technos,
>
> I need to cut some narrow strips out of 0.005" thick microstrip  
> alumina substrates. The diamond tips we have do an acceptable job  
> on the substrate, but tend to lift the corners of the 50 ohms trace.
>
> Is there any special tool for this kind of surgery?
>
> Thanks,
>
> Ioan Tempea, P. Eng.
> Senior Manufacturing Engineer, Satellite Systems
>
> [cid:[log in to unmask]]
>
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