Estimated Colleagues,
Recently we´ve held a CDR and have been considering each concern you
have mentioned. In spite of a pcb provider who ensured he can do that
some of us had our doubts on such a design and feasibility of production
then we ask you and received your unvaluable support.
Design department is already working on some pcb redesign. Definetivily
we decided to change original deployment, this is a critical operation
design so that it is not proper do not ensure less than 100% of
success.
Really appreciate your assistance and advise.
brgds,Ricardo
>>> Ricardo Moncaglieri <[log in to unmask]> 05/09/2017 11:22
>>>
Frank,
Thank you very much!
Richard has posted to you stack-up image and details.
brgds,Ricardo
>>> Frank Kimmey <[log in to unmask]> 05/09/2017 11:13 >>>
Ricardo,
Many of us who have worked in designing RF PCBs have had to use
differing dielectrics and stack ups.
Send me your proposed stack up directly and I'll try to see where you
may have issues affecting manufacturing and yields.
Use of different materials and/or asymmetric dielectrics is doable but
as always there is a cost.
Lower yields may have to be considered if your proposed is the only way
your circuit works.
Let's see if improvements are available.
Thanks,
FNK
Frank N Kimmey CID+
Electrical Engineer / PCB Design
VeriFone Inc
1400 W Stanford Ranch Road, Suite 200
Rocklin, CA 95765 USA
W: 1-916-625-1818
M: 1-916-833-9877
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri
Sent: Tuesday, September 05, 2017 6:55 AM
To: [log in to unmask]
Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF
Design
Richard,
Thank you very much for your feedback.
I´m affraid I´m not subscribed to Desiners Forum.
Could pls send to me its url to subscribe to the server list?
Again, thanks a lot.
brgds,Ricardo
>>> "Stadem, Richard D." <[log in to unmask]> 05/09/2017 10:50
>>>
Hi, Ricardo
I do not have the capability to post your picture, but I am sure Steve
can, and I see you have copied him.
Being that many people are taking vacations here this week as part of
Labor Day weekend, not sure when Steve will be in. You may need to wait
until later today.
In looking at the stack-up, I do not have a lot of expertise in this
area, but I do know that having differing layer thickness can maybe
cause some issues with different coefficients of thermal expansion
during reflow and other heat excursions. This can put stresses on the
vias passing all the way through the board. But I am not an expert in
those issues. One suggestion; you would be wise to also pose the
question to the Designers Forum. I am sure they can give you plenty of
advice on that.
Richard
From: Ricardo Moncaglieri [mailto:[log in to unmask]]
Sent: Tuesday, September 05, 2017 8:34 AM
To: Stadem, Richard D.; Steve Gregory
Subject: Re: Multilayer PCB of Different Substrat Thickness RF Design
Steve, Richard,
Would you pls upload the herebelow quoted image inord to be more clear
on my quetion to the forum?
Indeed hope to receive your comments / advise.
Keep awaiting.
Thank you very much, brgds,Ricardo
---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------
Estimated colleagues,
Nice to get in contact again with all of you after a bit long time.
We are deploying a RF design and by first time we intend to use a
multilayer pcb with different substrat thickness as shows the stack-up
herebelow detailed.
Questions here are:
As per your experience, is it recomendable such a kind of substrat
design?
Some pcb provider reported it is very difficult to achieve. Can you
recommend or share your background about pcb provider who can assure
high reliability on this pcb provision?
Keep awaiting for your unvaluable feedback.
brgds, Ricardo
Ricardo Moncaglieri
QA Electronic Service Manager
INVAP SE
www.invap.com.ar
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