TECHNET Archives

September 2017

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Douglas Pauls <[log in to unmask]>
Date:
Mon, 11 Sep 2017 09:24:11 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
Victor,
New users can sign up for any IPC email forums here:

http://www.ipc.org/ContentPage.aspx?pageid=E-mail-Forums

Just follow the directions.


Doug Pauls
Principal Materials and Process Engineer
Rockwell Collins

On Mon, Sep 11, 2017 at 9:18 AM, <[log in to unmask]> wrote:

> Fellow TechNetters:
>
>    What is the link for a NEW applicant to registrar as a TechNet Forum
> user?
>
> Victor,
>

ATOM RSS1 RSS2