TECHNET Archives

September 2017

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Wed, 6 Sep 2017 18:16:50 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (80 lines)
hmm, copper plated termination, look like shown in the image normally  
used for thin cap (embedded cap in PWB for example), normally Cu  
termination are Cu frit paste... that not easily dissolved in  
solder... but it didn't look like it on image... must be something new.
good to know.
jk
On Sep 6, 2017, at 5:59 PM, David Hillman wrote:

> Hi Joyce - the barrier layer can be either nickel or copper  
> depending on
> the component supplier. Obviously nickel is a better materials  
> choice for
> soldering process robustness but in terms of electrical  
> characteristics,
> some circuit designs work better with copper.
>
> Dave
>
> On Wed, Sep 6, 2017 at 4:58 PM, Yuan-chia Joyce Koo <[log in to unmask]>
> wrote:
>
>> http://www.electronicdesign.com/boards/rohs-implementation-challenges
>> see the cross section of Ceramic cap - metallization got Ni  
>> layer... not
>> seen on your image.  hopefully, it is not MFG missing a process  
>> (or cheap
>> stuff for low temp/ Ag adhesive potting type).
>> On Sep 6, 2017, at 3:01 PM, Yuan-chia Joyce Koo wrote:
>>
>> did it missing a Ni plating?  http://www.johansondielectrics
>>> .com/understanding-ceramic-capacitor-terminations
>>> best of luck.
>>> jk
>>> On Sep 6, 2017, at 12:25 PM, Giamis, Andy wrote:
>>>
>>> Hi TechNetters,
>>>>
>>>> Here’s something I have not seen before.
>>>> I have seven different ‘theories’ for what’s happening here.
>>>> Three of which do not involve mythical creatures, illegal  
>>>> substances or
>>>> the alignment of celestial bodies.
>>>>
>>>> This capacitor is on a path that sees a lot of RF power.
>>>> The unit went through 20 cycles of -70C to +115C while at nominal
>>>> power.  Temperature sensing suggests this device could be  
>>>> hitting 170C.
>>>> No, we normally don’t test to these extremes.
>>>> The PCB has ENiG finish and the solder is SAC.   This is normal  
>>>> SMT, no
>>>> rework.
>>>>
>>>> I think I know in general what happened, but I am surprised.
>>>> I don’t have an explanation for the formation of the big pocket  
>>>> on the
>>>> right.
>>>> Has anyone ever come across any solder joints like this?
>>>>
>>>> Thanks Steve for uploading the pictures (links below).
>>>>
>>>> http://stevezeva.homestead.com/pockets_25.jpg
>>>>
>>>> http://stevezeva.homestead.com/Pockets_CS.jpg
>>>>
>>>> http://stevezeva.homestead.com/Pocket-left.jpg
>>>>
>>>> http://stevezeva.homestead.com/Pockets-right.jpg
>>>>
>>>>
>>>> Best Regards,
>>>> Andy
>>>> Andrew C. Giamis
>>>> Senior Failure Analysis Engineer
>>>> CommScope
>>>> 2601 Telecom Pkwy
>>>> Richardson, TX, 75082, USA
>>>>
>>>>
>>>>

ATOM RSS1 RSS2