aha, someone paid the dues... consider you are endangered species...  
hard to come by... pat on your back...
On Sep 5, 2017, at 2:23 PM, Ken Barton wrote:

> I worked at two different fab houses, well before I went into  
> layout design. Not as a "plan", just how it went, & I now consider  
> the experience, particularly for design work invaluable.
>
> Ken Barton CID
> Technical Designer,
> Avionics HW
>
> Blue Origin, LLC
> 21218 76th Avenue S.
> Kent, WA 98032 (253) 437-5625 x625
> [log in to unmask]
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Yuan-chia Joyce  
> Koo
> Sent: Tuesday, September 05, 2017 10:45 AM
> To: [log in to unmask]
> Subject: [EXTERNAL] Re: [TN] Multilayer PCB of Different Substrat  
> Thickness RF Design
>
> i always believe to send designer to fab house for 6 month (even 3
> month) will do a world of good...
> On Sep 5, 2017, at 1:32 PM, Dwight Mattix wrote:
>
>> Fun times that.  Unbalanced in material thickness + single sided
>> sequential lam to get the last core into the stack. Hope you have an
>> experienced fabricator who is willing to plan some extra time
>> into the process for long press cool down and a flatbake after.
>> Don't rush that.
>>
>> Also, hope you're prefilling the blind via in the 62 mil core with a
>> non-conductive epoxy (e.g. San-Ei PHP).  Doubt 4450 is going to have
>> volume of free resin needed for that.
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
>> Sent: Tuesday, September 5, 2017 10:21 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF
>> Design
>>
>> Hi Ricardo,
>>
>> I finally have your picture posted, Richard was right, had some
>> pressing things on the production floor to take care of after the  
>> long
>> weekend.
>> Here's your stack-up drawing:
>>
>> http://stevezeva.homestead.com/Ricardo_Stackup.jpg
>>
>> Steve
>>
>> On Tue, Sep 5, 2017 at 7:50 AM, Stadem, Richard D.
>> <[log in to unmask]
>>> wrote:
>>
>>> Hi, Ricardo
>>>
>>> I do not have the capability to post your picture, but I am sure
>>> Steve can, and I see you have copied him.
>>>
>>> Being that many people are taking vacations here this week as  
>>> part of
>>> Labor Day weekend, not sure when Steve will be in. You may need to
>>> wait until later today.
>>>
>>> In looking at the stack-up, I do not have a lot of expertise in this
>>> area, but I do know that having differing layer thickness can maybe
>>> cause some issues with different coefficients of thermal expansion
>>> during reflow and other heat excursions. This can put stresses on  
>>> the
>>> vias passing all the way through the board. But I am not an  
>>> expert in
>>> those issues. One suggestion; you would be wise to also pose the
>>> question to the Designers Forum. I am sure they can give you plenty
>>> of advice on that.
>>>
>>> Richard
>>>
>>>
>>>
>>> *From:* Ricardo Moncaglieri [mailto:[log in to unmask]]
>>> *Sent:* Tuesday, September 05, 2017 8:34 AM
>>> *To:* Stadem, Richard D.; Steve Gregory
>>> *Subject:* Re: Multilayer PCB of Different Substrat Thickness RF
>>> Design
>>>
>>>
>>>
>>> Steve, Richard,
>>>
>>> Would you pls upload  the herebelow quoted image inord to be more
>>> clear on my quetion to the forum?
>>>
>>> Indeed hope to receive your comments / advise.
>>>
>>> Keep awaiting.
>>>
>>> Thank you very much, brgds,Ricardo
>>>
>>>
>>>
>>> ------------------------------------------------------------
>>> ------------------------------------------------------------
>>> -------------------------------------------------------------------- 
>>> -
>>>
>>> Estimated colleagues,
>>>
>>> Nice to get in contact again with all of you after a bit long time.
>>>
>>> We are deploying a RF design and by first time we intend to use a
>>> multilayer pcb with different substrat thickness as shows the
>>> stack-up herebelow detailed.
>>>
>>> Questions here are:
>>>
>>> As per your experience, is it recomendable such a kind of substrat
>>> design?
>>>
>>> Some pcb provider reported it is very difficult to achieve. Can you
>>> recommend or share your background about pcb provider who can assure
>>> high reliability on this pcb provision?
>>>
>>> Keep awaiting for your unvaluable feedback.
>>>
>>> brgds, Ricardo
>>>
>>> Ricardo Moncaglieri
>>>
>>> QA Electronic Service Manager
>>>
>>> INVAP SE
>>>
>>> www.invap.com.ar
>>>
>>>
>>
>>
>> --
>> Steve Gregory
>> Kimco Design and Manufacturing
>> Process Engineer
>> (208) 322-0500 Ext. -3133
>>
>> --
>>
>>
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