i always believe to send designer to fab house for 6 month (even 3
month) will do a world of good...
On Sep 5, 2017, at 1:32 PM, Dwight Mattix wrote:
> Fun times that. Unbalanced in material thickness + single sided
> sequential lam to get the last core into the stack. Hope you have
> an experienced fabricator who is willing to plan some extra time
> into the process for long press cool down and a flatbake after.
> Don't rush that.
>
> Also, hope you're prefilling the blind via in the 62 mil core with
> a non-conductive epoxy (e.g. San-Ei PHP). Doubt 4450 is going to
> have volume of free resin needed for that.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Steve Gregory
> Sent: Tuesday, September 5, 2017 10:21 AM
> To: [log in to unmask]
> Subject: Re: [TN] Multilayer PCB of Different Substrat Thickness RF
> Design
>
> Hi Ricardo,
>
> I finally have your picture posted, Richard was right, had some
> pressing things on the production floor to take care of after the
> long weekend.
> Here's your stack-up drawing:
>
> http://stevezeva.homestead.com/Ricardo_Stackup.jpg
>
> Steve
>
> On Tue, Sep 5, 2017 at 7:50 AM, Stadem, Richard D.
> <[log in to unmask]
>> wrote:
>
>> Hi, Ricardo
>>
>> I do not have the capability to post your picture, but I am sure
>> Steve
>> can, and I see you have copied him.
>>
>> Being that many people are taking vacations here this week as part of
>> Labor Day weekend, not sure when Steve will be in. You may need to
>> wait until later today.
>>
>> In looking at the stack-up, I do not have a lot of expertise in this
>> area, but I do know that having differing layer thickness can maybe
>> cause some issues with different coefficients of thermal expansion
>> during reflow and other heat excursions. This can put stresses on the
>> vias passing all the way through the board. But I am not an expert in
>> those issues. One suggestion; you would be wise to also pose the
>> question to the Designers Forum. I am sure they can give you
>> plenty of advice on that.
>>
>> Richard
>>
>>
>>
>> *From:* Ricardo Moncaglieri [mailto:[log in to unmask]]
>> *Sent:* Tuesday, September 05, 2017 8:34 AM
>> *To:* Stadem, Richard D.; Steve Gregory
>> *Subject:* Re: Multilayer PCB of Different Substrat Thickness RF
>> Design
>>
>>
>>
>> Steve, Richard,
>>
>> Would you pls upload the herebelow quoted image inord to be more
>> clear on my quetion to the forum?
>>
>> Indeed hope to receive your comments / advise.
>>
>> Keep awaiting.
>>
>> Thank you very much, brgds,Ricardo
>>
>>
>>
>> ------------------------------------------------------------
>> ------------------------------------------------------------
>> ---------------------------------------------------------------------
>>
>> Estimated colleagues,
>>
>> Nice to get in contact again with all of you after a bit long time.
>>
>> We are deploying a RF design and by first time we intend to use a
>> multilayer pcb with different substrat thickness as shows the
>> stack-up
>> herebelow detailed.
>>
>> Questions here are:
>>
>> As per your experience, is it recomendable such a kind of substrat
>> design?
>>
>> Some pcb provider reported it is very difficult to achieve. Can you
>> recommend or share your background about pcb provider who can assure
>> high reliability on this pcb provision?
>>
>> Keep awaiting for your unvaluable feedback.
>>
>> brgds, Ricardo
>>
>> Ricardo Moncaglieri
>>
>> QA Electronic Service Manager
>>
>> INVAP SE
>>
>> www.invap.com.ar
>>
>>
>
>
> --
> Steve Gregory
> Kimco Design and Manufacturing
> Process Engineer
> (208) 322-0500 Ext. -3133
>
> --
>
>
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