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Date: | Tue, 5 Sep 2017 13:50:19 +0000 |
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Hi, Ricardo
I do not have the capability to post your picture, but I am sure Steve can, and I see you have copied him.
Being that many people are taking vacations here this week as part of Labor Day weekend, not sure when Steve will be in. You may need to wait until later today.
In looking at the stack-up, I do not have a lot of expertise in this area, but I do know that having differing layer thickness can maybe cause some issues with different coefficients of thermal expansion during reflow and other heat excursions. This can put stresses on the vias passing all the way through the board. But I am not an expert in those issues. One suggestion; you would be wise to also pose the question to the Designers Forum. I am sure they can give you plenty of advice on that.
Richard
From: Ricardo Moncaglieri [mailto:[log in to unmask]]
Sent: Tuesday, September 05, 2017 8:34 AM
To: Stadem, Richard D.; Steve Gregory
Subject: Re: Multilayer PCB of Different Substrat Thickness RF Design
Steve, Richard,
Would you pls upload the herebelow quoted image inord to be more clear on my quetion to the forum?
Indeed hope to receive your comments / advise.
Keep awaiting.
Thank you very much, brgds,Ricardo
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Estimated colleagues,
Nice to get in contact again with all of you after a bit long time.
We are deploying a RF design and by first time we intend to use a multilayer pcb with different substrat thickness as shows the stack-up herebelow detailed.
Questions here are:
As per your experience, is it recomendable such a kind of substrat design?
Some pcb provider reported it is very difficult to achieve. Can you recommend or share your background about pcb provider who can assure high reliability on this pcb provision?
Keep awaiting for your unvaluable feedback.
brgds, Ricardo
Ricardo Moncaglieri
QA Electronic Service Manager
INVAP SE
www.invap.com.ar<http://www.invap.com.ar>
[cid:[log in to unmask]]
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