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September 2017

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Subject:
From:
Ricardo Moncaglieri <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ricardo Moncaglieri <[log in to unmask]>
Date:
Mon, 4 Sep 2017 11:31:18 -0300
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text/plain
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Estimated,
Stack-up drawing have been stripped from server and it is not showed on message.
Will send it by email to Steve Gregory so that he upload it on web.
brgds,
 
>>> Ricardo Moncaglieri <[log in to unmask]> 04/09/2017 11:18 >>>
Estimated colleagues, 
Nice to get in contact again with all of you after a bit long time. 
We are deploying a RF design and by first time we intend to use a multilayer pcb with different substrat thickness as shows the stack-up herebelow detailed. 
Questions here are: 
As per your experience, is it recomendable such a kind of substrat design?  
Some pcb provider reported it is very difficult to achieve. Can you recommend or share your background about pcb provider who can assure high reliability on this pcb provision? 
Keep awaiting for your unvaluable feedback. 
brgds, Ricardo 
 
Ricardo Moncaglieri 
QA Electronic Service Manager 
INVAP SE 
www.invap.com.ar 

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