Fellow TechNetters:

   Is anyone out there conducting the above solder test that is willing to share their experience?   From what I understand is that the entire specimen, board/card, can be passed across the wave solder to simulate solder float test C.   However, it does not state how many times the specimen is passed across the wave and is flipping of the specimen required.

4.2.4.3 Procedure Test specimens shall be fixtured so as to be representative of the production setup without components inserted. The fluxing unit should be filled with the specific (3.2.2) or agreed upon flux. If the unit contains other than the specified or agreed upon flux then the fluxing unit shall be turned off and the board test specimens fluxed separately prior to placement on the conveyor per 4.1. The following parameters must be established and noted: board fixturing (if required), conveyor speed, preheater, solder unit with or without oil intermix, machine process controls, incline, board preheat temperature and solder temperature. The application of solder shall meet the requirements of the applicable wave solder equipment, specifically for depth of contact, angle of contact, and duration of contact. Solder temperature shall be 235 ± 5 °C [455 ± 9 °F] unless another temperature is agreed upon by vendor and user. Prior to examination, all test specimens shall have the flux removed using a cleaning agent in accordance with 3.2.3.

Victor,