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Date: | Thu, 24 Aug 2017 15:58:25 -0400 |
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intermediate process should not use no-clean flux... it should use
low residue or no residue flux... if they used no clean flux, you
need to clean it before put on assembly (your part of parts qual
should including amount of flux residue allowable on the part). On
the other hand, what you can do on the assembly level, when you got
such a part...you need to use strong (corrosive possibly) flux/paste
and clean the assembly after if you have to (stuck with the parts or
vendor). IMHO.
good luck.
jk
On Aug 24, 2017, at 2:11 PM, Steven Kelly wrote:
> Hi All,
> I have a new hi-density BGA connector I am trying to assemble. When
> the supplier makes the connector they "solder balls onto the
> pin" (lead free). We see dried flux on the balls and when we solder
> the connector we are getting a few joints with head in pillow. The
> connector manufacturer says the dried flux is not an issue - is
> this true? Thanks. Steve Kelly
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