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Subject:
Re: 1:1:1 Copper Etchant, Delineation Region of copper plating interface
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Thu, 13 Jul 2017 19:42:41 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (75 lines) 
agree with Andy,  avoid UV (wrap in aluminum foil) and store in  
fridge if you have to..  fresh solution  only (even in fridge  - 24  
hour max)... my 2 cents...
On Jul 13, 2017, at 4:11 PM, Giamis, Andy wrote:

> Here's my thoughts:
>
> (a) use fresh chemicals.
> (b) If you are using 30% NH4OH, cut back on the DI H2O.
> (c) once mixed, this etchant has a short shelf life (several hours  
> at best)
>
> I use  25 ml of NH4OH (50%), 25 ml DI H2O and about 0.5 ml H2O2 (3%).
>
> Are you etching PCB copper or solid Cu slugs?
>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of  
> [log in to unmask]
> Sent: Thursday, July 13, 2017 2:44 PM
> To: [log in to unmask]
> Subject: Re: [TN] 1:1:1 Copper Etchant, Delineation Region of  
> copper plating interface
>
> Dell - Internal Use - Confidential
>
> That's the whole problem......   I only have the listed chemicals  
> to work with........
>
> Victor,
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Tony Lentz
> Sent: Thursday, July 13, 2017 2:37 PM
> To: [log in to unmask]
> Subject: Re: [TN] 1:1:1 Copper Etchant, Delineation Region of  
> copper plating interface
>
> Hello Victor,
>
> Increasing the concentration of the hydrogen peroxide will make  
> this solution more aggressive as a copper etchant.  The ammonium  
> hydroxide is mainly there to aid in keeping the copper dissolved as  
> a copper ammonium ion.
>
>
> Best regards,
>
> Tony Lentz
> Chemist / Field Application
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of  
> [log in to unmask]
> Sent: Thursday, July 13, 2017 1:17 PM
> To: [log in to unmask]
> Subject: [TN] 1:1:1 Copper Etchant, Delineation Region of copper  
> plating interface
>
> Fellow TechNetters:
>
>    Is there any possible way to make the above stated etchant  
> STRONGER/AGGRESSIVE:   Here are the chemicals:   Perhaps by varying  
> the volume of one of the three constituents.
>
> 1   -      Ammonium Hydroxide, 28.0 - 30.0%
> 1   -      Hydrogen Peroxide, 3%
> 1  -       Deionized water
>
> Victor,

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