If solder joint under inspection has to be reliable,  only X-Ray inspection
could tell you more...


-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Gumpert, Ben
Inviato: martedì 6 giugno 2017 22:54
A: [log in to unmask]
Oggetto: Re: [TN] Vertical fill

Peter,

I don't believe there is anything in IPC-A-610 specific to this, but there
are requirements in J-STD-001. See paragraph 4.18.3 "Partially Visible or
Hidden Solder Connections"

Ben

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Peter Wong
Sent: Tuesday, June 6, 2017 4:25 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Vertical fill

Hi everyone,

We have a conflict between inspectors.  We have a through hole header where
the destination side solder joints are partially hidden.
This is an IPC-A-610 Class 2 assembly and we are wondering what are the
requirements for vertical fill and wetting on the destination side when you
can't see them?

Thanks
Peter
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