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May 2017

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Subject:
From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Mon, 8 May 2017 14:09:22 +0000
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text/plain
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Hi Victor, 4761 simply describes the different types of via fill (except for plated shut microvias). 6012D provides minimum % fill requirements for some of the via types (the ones with material fill). 6012D also addresses min fill for microvias that are plated shut with copper. It does not address fill requirements for vias that are tented with soldermask (those are as specified in the drawing). If tenting with soldermask it required and no fill requirements are specified, then the only requirement is the presence of a tent.

José (Joey) Ríos, Sr QA Engineer
Mission Assurance
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
[log in to unmask] <mailto:[log in to unmask]>
(617)324-6272


> On May 8, 2017, at 8:43 AM, [log in to unmask] wrote:
> 
> Fellow TechNetters:
> 
>   I am requesting for some clarification on the above stated IPC document.   I did not see any Acceptance Criteria for the Via Fill Process.   Percentage of voids allowable, material shrinkage and birds eye.
> 
> Victor,

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