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Subject:
IPC-4761, dated, 07-2006
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 8 May 2017 12:43:06 +0000
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Fellow TechNetters:

   I am requesting for some clarification on the above stated IPC document.   I did not see any Acceptance Criteria for the Via Fill Process.   Percentage of voids allowable, material shrinkage and birds eye.

Victor,

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