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Subject:
Via fill - what parameters drive via filling?
From:
Nagaraj Shanmugam <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Nagaraj Shanmugam <[log in to unmask]>
Date:
Mon, 24 Apr 2017 07:13:32 +0000
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All,



I have a PCB of thickness 60mils(0.060"/1.53mm) and has a smallest through hole via is 4 mil(0.004"/0.1mm). These are NOT  Via in pad.

The aspect ratio here is 15.



Fab vendors asking for via fill here. Does these 4 mil via need to be filled?  I have boards done without fill for a 8mils drill on a 120mil thick board (Aspect ratio is 15 here). 



Appreciate to help to understand what parameter or factors determine the filling here.



Thanks,

Nagaraj.

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