Jose,



I think that the second half of the last sentence of 8.3.2 (specifically includes flux residues) answers your question:

  ...visual requirements for cleanliness (per 8.3) shall apply to all assemblies.



It says to me that you also inspect for flux using the inspection criteria given in 8.3



Ben



-----Original Message-----

From: TechNet [mailto:[log in to unmask]] On Behalf Of Jose A Rios

Sent: Wednesday, March 15, 2017 1:06 AM

To: [log in to unmask]

Subject: EXTERNAL: [TN] J-STD-001FS Section 8.3



Hi Tech-Netters, for the subject item (text is pasted below for reference):



8.3 Post Solder Cleanliness Visual inspection is used to assess the presence of foreign object debris as required in 8.3.1, see 12.2.2 of this Addendum. Flux and other ionic or organic residues are as required in 8.3.2.

Surfaces cleaned shall be inspected between 4X and 10X magnification and shall be free of visual evidence of residue or contaminants. 



First sentence addresses FOD, thats clear. The second sentence addresses flux residues per 8.3.2, which is cleanliness testing (and inevitably leads to 8.3.6.3, because of C-22 and the use of ROL type flux). Is the third sentence from section 8.3 above, about residues/contaminants other than flux?? Are flux residues allowed then provided the assembly passes cleanliness testing??





José (Joey) Ríos, Sr QA Engineer

Mission Assurance

Kavli Institute for Astrophysics & Space Research Massachusetts Institute of Technology [log in to unmask] <mailto:[log in to unmask]>

(617)324-6272