Hi Tech-Netters, for the subject item (text is pasted below for reference):

8.3 Post Solder Cleanliness Visual inspection is used to assess the presence of foreign object debris as required
in 8.3.1, see 12.2.2 of this Addendum. Flux and other ionic or organic residues are as required in 8.3.2.
Surfaces cleaned shall be inspected between 4X and 10X magnification and shall be free of visual evidence of
residue or contaminants. 

First sentence addresses FOD, thats clear. The second sentence addresses flux residues per 8.3.2, which is cleanliness testing (and inevitably leads to 8.3.6.3, because of C-22 and the use of ROL type flux). Is the third sentence from section 8.3 above, about residues/contaminants other than flux?? Are flux residues allowed then provided the assembly passes cleanliness testing??


José (Joey) Ríos, Sr QA Engineer
Mission Assurance
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
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