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March 2017

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Subject:
Re: Preconditioning Bake PWB coupons before Thermal Stress
From:
Jose A Rios <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jose A Rios <[log in to unmask]>
Date:
Wed, 15 Mar 2017 00:23:30 +0000
Content-Type:
text/plain
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text/plain (35 lines) 
See section 5.1 of this document https://www.ipc.org/TM/2.6.8E.pdf <https://www.ipc.org/TM/2.6.8E.pdf> for the solder float method.
See section 5.1 of this document https://www.ipc.org/TM/2-6_2-6-27.pdf <https://www.ipc.org/TM/2-6_2-6-27.pdf> for the convection reflow assembly simulation method.


José (Joey) Ríos, Sr QA Engineer
Mission Assurance
Kavli Institute for Astrophysics & Space Research
Massachusetts Institute of Technology
[log in to unmask] <mailto:[log in to unmask]>
(617)324-6272



> On Mar 14, 2017, at 4:18 AM, [log in to unmask] wrote:
> 
> Fellow TechNetters:
> 
>    What is the most current IPC Precondditioning Bake of PWB coupons before Thermal Stress Testing?
> 
> Victor,
> 
> 
> 
> From: Hernandez, Victor G
> Sent: Monday, March 13, 2017 2:10 PM
> To: TechNet E-Mail Forum <[log in to unmask]>
> Cc: Hernandez, Victor G <[log in to unmask]>
> Subject: PWB Drying/Baking Standard
> 
> Fellow TechNetters:
> 
>    What is the most current IPC PWB Drying/Baking Standard.
> 
> Victor,

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