Dean,
I believe the current design standard is IPC-2221 and 2222.
Doug Pauls
Principal Materials and Process Engineer
Rockwell Collins
On Tue, Mar 7, 2017 at 3:07 PM, Stadem, Richard D. <[log in to unmask]
> wrote:
> Apparently not.
>
> From: Iulia Muntele [mailto:[log in to unmask]]
> Sent: Tuesday, March 07, 2017 2:34 PM
> To: Stadem, Richard D.
> Cc: TechNet E-Mail Forum
> Subject: Re: [TN] BGA periphery keep out zone
>
> Is there a more recent version for IPC-D-279 than the one from 1996?
>
> On Tue, Mar 7, 2017 at 2:25 PM, Stadem, Richard D. <
> [log in to unmask]<mailto:[log in to unmask]>> wrote:
> That is all covered in the Design Standard, IPC-D-279, Section 3.3.9
> "Component Spacing", Section 8.0 "Design for Testability", and the section
> on Design for Reworkability.
> It's all there. Just $80 from your beautiful local IPC Sales
> Representative, and no self-respecting Electronics Design or Electronics
> Manufacturing Engineer should be caught without a current copy. You may
> wish to keep a copy in the fiskhytte as well for those slow times.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]<mailto:[log in to unmask]>] On Behalf
> Of Iulia Muntele
> Sent: Tuesday, March 07, 2017 2:07 PM
> To: [log in to unmask]<mailto:[log in to unmask]>
> Subject: Re: [TN] BGA periphery keep out zone
>
> None that I can think off. There should not be any limitations at
> placement, maybe at rework and inspection.
>
> On Tue, Mar 7, 2017 at 2:04 PM, <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
>
> > Fellow TechNetters:
> >
> > Which IPC Standard cover the above stated limits for components
> > placement on the periphery of a BGA foot print?
> >
> > Victor,
> >
>
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